Laser MicromachiningMLPC provides a wide range of laser micromachining services to complement your research & development efforts as well as production processes. "MLPC has been rapidly developing this technology through defense and commercial programs. Laser micromachining continues to push the threshold for device miniaturization and small component machining. We pick up where conventional machining leaves off and are on a path to nanoscale fabrication." -- Dr. Larry Dosser, President & CEO of MLPC Laser MicromachiningLaser micromachining is a general term that includes a variety of processes including hole drilling, ablation, milling, and cutting. MLPC uses solid-state laser technology combined with a multi-axis work station to offer a fully integrated micromachining capability. This equipment uses CAD geometry to direct-write the customer required geometry. The features which can be laser micromachined range from 5 micron and up in size. MLPC has expertise in both nanosecond and picosecond laser technology, and has access to 355nm, 532nm, and 1064nm wavelengths. The combination of pulse durations and laser wavelengths enable the processing of materials ranging from metals to ceramics to polymers.
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