Ultrafast Laser Micromachining

MLPC has been rapidly developing laser micromachining technology through defense and commercial programs.

Process Overview

Laser micromachining is a general term that includes a variety of processes including hole drilling, ablation, milling, and cutting. MLPC uses solid-state laser technology combined with a multi-axis work station to offer a fully integrated micromachining capability. MLPC is one of the only contract laser service companies in the country to offer picosecond laser micromachining which can process metals, polymers, and ceramics with no peripheral damage. This equipment uses CAD geometry to direct-write the customer required geometry. The features which can be laser micromachined range from 5 micron and up in size. MLPC has expertise in both nanosecond and picosecond laser technology, and has access to 355nm, 532nm, and 1064nm wavelengths.

Material Selection

The combination of pulse durations and laser wavelengths enable the processing of materials ranging from metals to ceramics to polymers.

Production Services

Laser micromachining is often used for research and development and prototype development; the opportunity to take these applications into production exists. MLPC can transfer the technology from R&D to production services. Many of medical device manufacturers take advantage of MLPC’s dual capability—to conduct research and provide production services.

Applications

Example applications for the medical device industry include: micro implant manufacturing, micro batteries, and miniaturized minimally invasive tools. For the defense industry, example applications include: micro air vehicle components fabrication, surface texturing of aircraft components, and vehicle health monitoring sensors.

Laser micromachining continues to push the threshold for device miniaturization and small component machining. We pick up where conventional machining leaves off and are on a path to nanoscale fabrication.

Dr. Larry Dosser President & CEO of MLPC